Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US17048255Application Date: 2019-04-16
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Publication No.: US11705524B2Publication Date: 2023-07-18
- Inventor: Tetsuya Kakehata , Yuta Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Husch Blackwell LLP
- Priority: JP 18086200 2018.04.27
- International Application: PCT/IB2019/053112 2019.04.16
- International Announcement: WO2019/207411A 2019.10.31
- Date entered country: 2020-10-16
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/24 ; H01L29/66

Abstract:
A semiconductor device with high on-state current and high reliability is provided. The semiconductor device includes first to fifth insulators, first to third oxides, and first to fourth conductors; the fifth insulator includes an opening in which the second oxide is exposed; the third oxide is placed in contact with a bottom portion of the opening and a side portion of the opening; the second insulator is placed in contact with the third oxide; the third conductor is provided in contact with the second insulator; the third insulator is placed in contact with a top surface of the third conductor and the second insulator; and the fourth conductor is in contact with the third insulator and the top surface of the third conductor and placed in the opening.
Public/Granted literature
- US20210234046A1 Semiconductor Device and Method for Manufacturing Semiconductor Device Public/Granted day:2021-07-29
Information query
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