Invention Grant
- Patent Title: Electronic device including heat dissipation member
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Application No.: US17512168Application Date: 2021-10-27
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Publication No.: US11706904B2Publication Date: 2023-07-18
- Inventor: Jooyoung Kang , Myunghoon Kwak , Baekeun Cho , Hyunsuk Kim , Sanghyuk Park , Soohyun Seo , Nakhyun Choi , Yangwook Kim , Hyunju Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20200147415 2020.11.06 KR 20210021817 2021.02.18
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H04M1/02 ; G06F1/20 ; H05K9/00

Abstract:
An electronic device is provided, which may include a first housing; a second housing configured to accommodate at least a portion of the first housing and guide a sliding movement of the first housing; a display including a first display area disposed on the first housing and a second display area extending from the first display area; a PCB configured to accommodate at least one electronic component; a support member configured to support the PCB; a side wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet being disposed on the support member and the side wall member; and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.
Public/Granted literature
- US20220151106A1 ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION MEMBER Public/Granted day:2022-05-12
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