- Patent Title: Film-shaped firing material, film-shaped firing material provided with support sheet, method for manufacturing film-shaped firing material, and method for manufacturing film-shaped firing material provided with support sheet
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Application No.: US16605373Application Date: 2018-02-13
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Publication No.: US11707787B2Publication Date: 2023-07-25
- Inventor: Isao Ichikawa
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Priority: JP 17090715 2017.04.28
- International Application: PCT/JP2018/004859 2018.02.13
- International Announcement: WO2018/198485A 2018.11.01
- Date entered country: 2019-10-15
- Main IPC: B22F7/04
- IPC: B22F7/04 ; B22F5/00 ; C09J1/00 ; C09J133/08 ; H01L21/683 ; H01L23/00 ; B22F1/10 ; C08K3/08
Abstract:
This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.
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