Invention Grant
- Patent Title: Nonvolatile memory device
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Application No.: US17455037Application Date: 2021-11-16
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Publication No.: US11709629B2Publication Date: 2023-07-25
- Inventor: Yonghyuk Choi , Jaeduk Yu , Sangwan Nam , Sangwon Park , Daeseok Byeon , Bongsoon Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20190148349 2019.11.19
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F3/06 ; G11C16/08 ; G11C16/24 ; G11C16/04 ; H10B41/27 ; H10B43/27

Abstract:
A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.
Public/Granted literature
- US20220075565A1 NONVOLATILE MEMORY DEVICE Public/Granted day:2022-03-10
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