Invention Grant
- Patent Title: Integrated circuit device
-
Application No.: US17352763Application Date: 2021-06-21
-
Publication No.: US11710738B2Publication Date: 2023-07-25
- Inventor: Keomyoung Shin , Pankwi Park , Seunghun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20190055843 2019.05.13
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/26 ; H01L29/78 ; H01L29/08 ; H01L29/06

Abstract:
An integrated circuit (IC) device includes a fin-type active region extending lengthwise in a first direction, a plurality of nanosheets overlapping each other in a second direction on a fin top surface of the fin-type active region, and a source/drain region on the fin-type active region and facing the plurality of nanosheets in the first direction. The plurality of nanosheets include a first nanosheet, which is closest to the fin top surface of the fin-type active region and has a shortest length in the first direction, from among the plurality of nanosheets. The source/drain region includes a source/drain main region and a first source/drain protruding region protruding from the source/drain main region. The first source/drain protruding region protrudes from the source/drain main region toward the first nanosheet and overlaps portions of the plurality of nanosheets in the second direction.
Public/Granted literature
- US20210313322A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2021-10-07
Information query
IPC分类: