Invention Grant
- Patent Title: Dies including strain gauge sensors and temperature sensors
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Application No.: US17105195Application Date: 2020-11-25
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Publication No.: US11712887B2Publication Date: 2023-08-01
- Inventor: James M. Gardner , Berkeley Fisher , Daryl E Anderson
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company L.P.
- Current Assignee: Hewlett-Packard Development Company L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J29/393 ; G01L1/18 ; G01L1/22
Abstract:
A die may include a plurality of fluid pumps, at least one strain gauge sensor to sense a strain in the die, and at least one temperature sensor to sense the temperature of the die to compensate for a temperature component of the sensed strain.
Public/Granted literature
- US20210078320A1 DIES INCLUDING STRAIN GAUGE SENSORS AND TEMPERATURE SENSORS Public/Granted day:2021-03-18
Information query
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