Invention Grant
- Patent Title: Nozzle arrangements and supply channels
-
Application No.: US17713200Application Date: 2022-04-04
-
Publication No.: US11712896B2Publication Date: 2023-08-01
- Inventor: Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Iam J. Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Main IPC: B41J2/145
- IPC: B41J2/145 ; B41J2/14

Abstract:
Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
Public/Granted literature
- US20220227131A1 NOZZLE ARRANGEMENTS AND SUPPLY CHANNELS Public/Granted day:2022-07-21
Information query
IPC分类: