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公开(公告)号:US12233645B2
公开(公告)日:2025-02-25
申请号:US18018253
申请日:2020-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Thomas Martin , Garrett E. Clark , Jeremy Spencer , Vincent C. Korthuis , Rogelio Cicili
IPC: B41J2/045
Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.
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公开(公告)号:US12023937B2
公开(公告)日:2024-07-02
申请号:US17798902
申请日:2020-03-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Jacob M. Lum , Si-lam J. Choy , Jeffrey R. Pollard , Tsuyoshi Yamashita , Jeremy Sells , Garrett E. Clark
CPC classification number: B41J2/18 , B41J2/1408
Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.
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公开(公告)号:US20220105726A1
公开(公告)日:2022-04-07
申请号:US17551489
申请日:2021-12-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Mark H. MacKenzie
Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.
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公开(公告)号:US10780699B2
公开(公告)日:2020-09-22
申请号:US15764273
申请日:2015-10-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Garrett E. Clark , Mark H. MacKenzie
Abstract: In one example in accordance with the present disclosure a printhead is described. The printhead includes a number of nozzles to deposit an amount of fluid onto a print medium and an ink delivery system to deliver the amount of fluid from an ink tank to the number of nozzles. The printhead also includes an attachment feature to removably couple a removable printhead cover to the printhead. The printhead further includes a removable printhead cover removably coupled to the printhead at the attachment feature.
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公开(公告)号:US10207497B2
公开(公告)日:2019-02-19
申请号:US15986593
申请日:2018-05-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Garrett E. Clark , Mark H. MacKenzie
IPC: B41J2/045
Abstract: Selecting nozzles can include selecting nozzles of a plurality of nozzles to print a portion of a print job based on content of the print job and assigning firing reservations to the selected nozzles, where a total number of the firing reservations assigned to the selected nozzles is comparatively less than a total number of the plurality of nozzles.
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公开(公告)号:US20180319655A1
公开(公告)日:2018-11-08
申请号:US15772377
申请日:2016-02-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
CPC classification number: B81B7/0083 , B01L3/5027 , B01L3/502707 , B01L3/50273 , B01L3/502784 , B01L2300/0867 , B01L2300/087 , B01L2300/088 , B01L2300/1827 , B01L2300/1894 , B01L2400/0442 , B01L2400/046 , B41J2/1433 , B81B1/006 , B81B2203/0338 , B81C1/00119 , F04B19/006 , F04B43/046
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
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公开(公告)号:US20180147841A1
公开(公告)日:2018-05-31
申请号:US15570827
申请日:2015-07-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Mark H. MacKenzie , Jose Luis Valero
CPC classification number: B41J2/04563 , B41J2/04508 , B41J2/0458 , B41J2/14153 , B41J2/155
Abstract: A temperature of one printing element is adjusted based upon a temperature of another of printing element.
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公开(公告)号:US20150314599A1
公开(公告)日:2015-11-05
申请号:US14418664
申请日:2012-09-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Chris Bakker , Mark H. MacKenzie , Michele D. Friesen
CPC classification number: B41J2/1433 , B41J2/1404 , B41J2/14072 , B41J2/14145 , B41J2/21 , B41J2/2103 , B41J2/2128 , B41J2/2146 , B41J2002/14491
Abstract: A print head die is described. In one example, the print head die includes a substrate having liquid feed slots formed therein extending along a major dimension of the substrate and nozzles extending along opposite sides of each of the liquid feed slots; and electrical interconnect formed on the substrate along the major dimension adjacent a last one of the liquid feed slots. A first one of the liquid feed slots opposite the last liquid feed slot and farthest from the electrical interconnect supplies an ink using a higher drop volume than inks in other ones of the liquid feed slots. The last liquid feed slot supplies an ink having a higher contrast with the ink in the first liquid feed slot than with inks in other ones of the liquid feed slots.
Abstract translation: 描述打印头模具。 在一个示例中,打印头模具包括其中形成有沿着基板的主要尺寸延伸的液体进料槽的基板和沿每个液体进料槽的相对侧延伸的喷嘴; 以及沿着与最后一个液体进料槽相邻的主要尺寸在基底上形成的电互连。 与最后一个液体供给槽相对的最远的液体进料槽中的第一个液体进料槽与液体进料槽中的其它液体进料槽中的油墨相比,使用较高的液滴体积提供油墨。 最后的液体进料槽提供与第一液体进料槽中的油墨具有更高对比度的油墨,而不是其它液体进料槽中的油墨。
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公开(公告)号:US12128684B2
公开(公告)日:2024-10-29
申请号:US17921333
申请日:2020-05-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Daryl Eugene Anderson , James R. Przybyla , Eric T. Martin , Garrett E. Clark
CPC classification number: B41J2/1404 , B41J2/14145 , B41J2/175 , B41J2/18 , B41J2002/14459 , B41J2202/12
Abstract: An example fluid ejection device comprises a plurality of distinct fluid channels. Each fluid channel comprises a distinct fluid inlet to the ejection device. A subset of the plurality of distinct fluid channels comprises fluid recirculating fluid channels, and the remaining fluid channels comprising non-recirculating fluid channels.
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公开(公告)号:US11807005B2
公开(公告)日:2023-11-07
申请号:US18127619
申请日:2023-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Lam J. Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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