Invention Grant
- Patent Title: Electrically formed memory array using single element materials
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Application No.: US17122464Application Date: 2020-12-15
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Publication No.: US11716861B2Publication Date: 2023-08-01
- Inventor: Andrea Redaelli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H10B63/00
- IPC: H10B63/00 ; G11C13/00 ; H10N70/00 ; H10N70/20

Abstract:
Electrically formed memory arrays, and methods of processing the same are described herein. A number of embodiments include a plurality of conductive lines separated from one other by an insulation material, a first plurality of conductive extensions arranged to extend substantially perpendicular to the plurality of conductive lines, a storage element material formed around each respective one of the first plurality of conductive extensions, a second plurality of conductive extensions arranged to extend substantially perpendicular to the plurality of conductive lines, and a plurality of single element materials formed around each respective one of the second plurality of conductive extensions.
Public/Granted literature
- US20220190032A1 ELECTRICALLY FORMED MEMORY ARRAY Public/Granted day:2022-06-16
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