Invention Grant
- Patent Title: Method of forming multi-bit resistive random access memory cell
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Application No.: US17483790Application Date: 2021-09-23
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Publication No.: US11716912B2Publication Date: 2023-08-01
- Inventor: Po-Yu Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 1910953647.9 2019.10.09
- The original application number of the division: US16655262 2019.10.17
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H10N70/00 ; H10B63/00

Abstract:
A multi-bit resistive random access memory cell includes a plurality of bottom electrodes, a plurality of dielectric layers, a top electrode and a resistance layer. The bottom electrodes and the dielectric layers are interleaved layers, each of the bottom electrodes is sandwiched by the dielectric layers, and a through hole penetrates through the interleaved layers. The top electrode is disposed in the through hole. The resistance layer is disposed on a sidewall of the through hole and is between the top electrode and the interleaved layers, thereby the top electrode, the resistance layer and the bottom electrodes constituting a multi-bit resistive random access memory cell. The present invention also provides a method of forming the multi-bit resistive random access memory cell.
Public/Granted literature
- US20220013718A1 METHOD OF FORMING MULTI-BIT RESISTIVE RANDOM ACCESS MEMORY CELL Public/Granted day:2022-01-13
Information query
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