Invention Grant
- Patent Title: Unified systems and methods for interchip and intrachip node communication
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Application No.: US17363407Application Date: 2021-06-30
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Publication No.: US11720512B2Publication Date: 2023-08-08
- Inventor: Richard Dominic Wietfeldt , Maxime Leclercq , George Alan Wiley
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: W&T/Qualcomm
- The original application number of the division: US14850104 2015.09.10
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; H04L43/0817

Abstract:
Unified systems and methods for interchip and intrachip node communication are disclosed. In one aspect, a single unified low-speed bus is provided that connects each of the chips within a computing device. The chips couple to the bus through a physical layer interface and associated gateway. The gateway includes memory that stores a status table summarizing statuses for every node in the interface fabric. As nodes experience state changes, the nodes provide updates to associated local gateways. The local gateways then message, using a scout message, remote gateways with information relating to the state changes. When a first node is preparing a signal to a second node, the first node checks the status table at the associated local gateway to determine a current status for the second node. Based on the status of the second node, the first node may send the message or take other appropriate action.
Public/Granted literature
- US20210326290A1 UNIFIED SYSTEMS AND METHODS FOR INTERCHIP AND INTRACHIP NODE COMMUNICATION Public/Granted day:2021-10-21
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