Invention Grant
- Patent Title: Semiconductor package device and semiconductor process
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Application No.: US17368688Application Date: 2021-07-06
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Publication No.: US11721645B2Publication Date: 2023-08-08
- Inventor: Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/29 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.
Public/Granted literature
- US20210335729A1 SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS Public/Granted day:2021-10-28
Information query
IPC分类:
