Invention Grant
- Patent Title: Semiconductor package having stacked semiconductor chips
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Application No.: US17568558Application Date: 2022-01-04
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Publication No.: US11721673B2Publication Date: 2023-08-08
- Inventor: Hyuekjae Lee , Jihoon Kim , Jihwan Suh , Soyoun Lee , Jiseok Hong , Taehun Kim , Jihwan Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190089991 2019.07.25
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/31 ; H01L23/16 ; H01L23/00 ; H01L23/538

Abstract:
Provided is a semiconductor package including a semiconductor stack including a first lower chip, a second lower chip, a gap filler disposed between the first lower chip and the second lower chip, and a first upper chip disposed on an upper surface of the first lower chip, an upper surface of the second lower chip, and an upper surface of the gap filler, the first lower chip includes first upper surface pads and a first upper surface dielectric layer, the second lower chip includes second upper surface pads and a second upper surface dielectric layer, the first upper chip includes lower surface pads and a lower surface dielectric layer, and an area of an upper surface of each of the second upper surface pads is greater than an area of a lower surface of each of the lower surface pads.
Public/Granted literature
- US20220130801A1 SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS Public/Granted day:2022-04-28
Information query
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