Invention Grant
- Patent Title: HEMT and method of fabricating the same
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Application No.: US17153844Application Date: 2021-01-20
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Publication No.: US11721751B2Publication Date: 2023-08-08
- Inventor: Po-Yu Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2011350160.0 2020.11.26
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/66 ; H01L29/47 ; H01L21/285 ; H01L29/205 ; H01L29/423

Abstract:
An HEMT includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer. The composition of the first III-V compound layer is different from that of the second III-V compound layer. A gate is disposed on the second III-V compound layer. The gate includes a first P-type III-V compound layer, an undoped III-V compound layer and an N-type III-V compound layer are deposited from bottom to top. The first P-type III-V compound layer, the undoped III-V compound layer, the N-type III-V compound layer and the first III-V compound layer are chemical compounds formed by the same group III element and the same group V element. A drain electrode is disposed at one side of the gate. A drain electrode is disposed at another side of the gate. A gate electrode is disposed directly on the gate.
Public/Granted literature
- US20220165873A1 HEMT AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-05-26
Information query
IPC分类: