Invention Grant
- Patent Title: Configuring an additive manufacturing system
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Application No.: US16605382Application Date: 2018-04-06
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Publication No.: US11724459B2Publication Date: 2023-08-15
- Inventor: Pol Fornos Martinez , Emilio Sapena Masip , Manuel Freire Garcia
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Michael Dryja
- International Application: PCT/US2018/026565 2018.04.06
- International Announcement: WO2019/194836A 2019.10.10
- Date entered country: 2019-10-15
- Main IPC: B29C64/393
- IPC: B29C64/393 ; B33Y30/00 ; B33Y50/02 ; B29C64/153 ; B33Y10/00 ; B29C64/295

Abstract:
A method of configuring an additive manufacturing system. The method comprises configuring the additive manufacturing system with a first value of an operation parameter associated with the additive manufacturing system and, with the additive manufacturing system configured with the first value of the operation parameter, forming, in a build chamber, a first object The additive manufacturing system is subsequently configured with a second value of the operation parameter and, with the additive manufacturing system configured with the second value of the operation parameter, a second object is formed in the build chamber, subsequently to forming the first object. The method further includes receiving a signal indicative of which of the first value or the second value the operation parameter is to be configured with for subsequent operation of the additive manufacturing system.
Public/Granted literature
- US20210122119A1 CONFIGURING AN ADDITIVE MANUFACTURING SYSTEM Public/Granted day:2021-04-29
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