Invention Grant
- Patent Title: Multi-scale spectral imaging apparatuses and methods, and methods of manufacturing semiconductor devices by using the imaging methods
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Application No.: US17225275Application Date: 2021-04-08
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Publication No.: US11726046B2Publication Date: 2023-08-15
- Inventor: Jaehwang Jung , Hyejin Shin , Wookrae Kim , Gwangsik Park , Myungjun Lee , Yongju Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20200113195 2020.09.04
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G01B11/25

Abstract:
An imaging apparatus includes a light source configured to generate and output light, a stage having a measurement target thereon, a line-scan spectral imaging (SI) optical system configured to measure the measurement target using a first scale and to slopingly irradiate the light from the light source onto the measurement target in a line beam shape, divide light reflected by the measurement target, and perform imaging of the divided light, and an angle-resolved SI optical system configured to measure the measurement target at a second scale that is smaller than the first scale and configured to divide the light from the light source into monochromatic light, slopingly irradiate the monochromatic light onto the measurement target by using a reflective objective lens, and perform imaging of light reflected by the measurement target.
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