SEMICONDUCTOR MEASUREMENT APPARATUS

    公开(公告)号:US20240418645A1

    公开(公告)日:2024-12-19

    申请号:US18408247

    申请日:2024-01-09

    Abstract: An example semiconductor measurement apparatus includes a light source, a pattern generator, a stage, an image sensor, and a controller. The light source is configured to output light in a predetermined wavelength band. The pattern generator is configured to generate light including a speckle pattern by scattering the light output from the light source. The stage is disposed on a movement path of the light including the speckle pattern, and a sample reflecting the light including the speckle pattern is seated on the stage. The image sensor is configured to receive light reflected from the sample and generate an original image representing a diffractive pattern of light reflected from the sample. The controller is configured to generate a prediction image for estimating diffractive characteristics of light incident on the image sensor.

    HOLOGRAPHIC MICROSCOPE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20210200148A1

    公开(公告)日:2021-07-01

    申请号:US17060526

    申请日:2020-10-01

    Abstract: Provided is a holographic microscope including an input optical system configured to emit polarized input beam, a first beam splitter configured to emit an object beam by reflecting a portion of the polarized input beam, and emit a reference beam by transmitting a remaining portion of the polarized input beam, a reference optical system configured to separate the reference beam into a first reference beam and a second reference beam, a camera configured to receive the first reference beam and the second reference beam and the object beam that is reflected by an inspection object, the camera including a micro polarizer array, wherein a first polarization axis of the first reference beam is perpendicular to a second polarization axis of the second reference beam.

    Digital Holography Microscope (DHM), and Inspection Method and Semiconductor Manufacturing Method Using the DHM

    公开(公告)号:US20220276607A1

    公开(公告)日:2022-09-01

    申请号:US17716257

    申请日:2022-04-08

    Abstract: A low-cost digital holography microscope (DHM) that is capable of performing inspection at high speed while accurately inspecting an inspection object at high resolution, an inspection method using the DHM, and a method of manufacturing a semiconductor device by using the DHM are provided. The DHM includes: a light source configured to generate and output light; a beam splitter configured to cause the light to be incident on an inspection object and output reflected light from the inspection object; and a detector configured to detect the reflected light, wherein, when the reflected light includes interference light, the detector generates a hologram of the interference light, and wherein no lens is present in a path from the light source to the detector.

    Semiconductor measurement apparatus

    公开(公告)号:US12222282B2

    公开(公告)日:2025-02-11

    申请号:US18082040

    申请日:2022-12-15

    Abstract: A semiconductor measurement apparatus includes an illumination unit configured to provide illumination light including linearly polarized light beams having different wavelengths, an optical unit including an objective lens configured to allow the illumination light to be incident on a sample, the optical unit being configured to transmit reflection light generated when the illumination light is reflected from the sample, a self-interference generator configured to self-interfere the reflection light transmitted from the optical unit and transmit the reflection light to a first image sensor, for each wavelength, and a controller. The controller is configured to process a measurement image output by the image sensor to divide the measurement image into a first image representing an intensity ratio of a polarization component of the reflection light and a second image representing a phase difference of the polarization component of the reflection light, for each wavelength.

    SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD

    公开(公告)号:US20240219315A1

    公开(公告)日:2024-07-04

    申请号:US18493226

    申请日:2023-10-24

    CPC classification number: G01N21/9501 G01N21/8806 G01N21/956

    Abstract: A substrate inspection apparatus includes a light irradiator including an objective lens and a plurality of optical fibers. The objective lens is configured to irradiate light to an illumination area on a semiconductor substrate having a plurality of circuit pattern layers, the plurality of optical fibers are adjacent a periphery of the objective lens and are configured to irradiate the light to a peripheral area adjacent the illumination area. A light generator is configured to generate the light. The light generator is configured to change an irradiation angle of the light to selectively irradiate the light to one or more of the objective lens and the plurality of optical fibers. A light analyzer is configured to obtain images of the circuit pattern layers from the light reflected from the illumination area and the peripheral area. The light analyzer is configured to model each of the circuit pattern layers of the semiconductor substrate to obtain image models and to measure an overlay between the circuit pattern layers through the images and the image models.

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