Invention Grant
- Patent Title: Spin on carbon composition and method of manufacturing a semiconductor device
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Application No.: US17864293Application Date: 2022-07-13
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Publication No.: US11728161B2Publication Date: 2023-08-15
- Inventor: Jing Hong Huang , Ching-Yu Chang , Wei-Han Lai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- The original application number of the division: US16984070 2020.08.03
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A spin on carbon composition, comprises: a carbon backbone polymer; a first crosslinker; and a second crosslinker. The first crosslinker reacts with the carbon backbone polymer to partially crosslink the carbon backbone polymer at a first temperature, and the second crosslinker reacts with the carbon backbone polymer to further crosslink the carbon backbone polymer at a second temperature higher than the first temperature. The first crosslinker is a monomer, oligomer, or polymer. The second crosslinker is a monomer, oligomer, or polymer. The first and second crosslinkers are different from each other. When either of the first crosslinker or the second crosslinker is a polymer, the polymer is a different polymer than the carbon backbone polymer.
Public/Granted literature
- US20220367178A1 SPIN ON CARBON COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2022-11-17
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