Invention Grant
- Patent Title: Capacitor die embedded in package substrate for providing capacitance to surface mounted die
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Application No.: US17518504Application Date: 2021-11-03
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Publication No.: US11728294B2Publication Date: 2023-08-15
- Inventor: Andrew Collins , Sujit Sharan , Jianyong Xie
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/522 ; H01L23/538 ; H01L23/528 ; H01L25/00 ; H01L21/48 ; H01L25/16 ; H01L23/48
Abstract:
A package substrate is disclosed. The package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. Connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.
Public/Granted literature
- US20220059476A1 CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE Public/Granted day:2022-02-24
Information query
IPC分类:
