- Patent Title: Rectangular waveguide communication between memory and processor
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Application No.: US17461539Application Date: 2021-08-30
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Publication No.: US11728555B2Publication Date: 2023-08-15
- Inventor: Yoshihito Koya
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- The original application number of the division: US16141797 2018.09.25
- Main IPC: G06F3/12
- IPC: G06F3/12 ; H01P3/12 ; H01P1/24 ; H05K1/18 ; H05K1/02 ; G06F13/16 ; G06F13/40 ; H01P5/08
Abstract:
Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.
Public/Granted literature
- US20210391634A1 RECTANGULAR WAVEGUIDE COMMUNICATION BETWEEN MEMORY AND PROCESSOR Public/Granted day:2021-12-16
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