Invention Grant
- Patent Title: 3D memory devices
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Application No.: US16844429Application Date: 2020-04-09
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Publication No.: US11729972B2Publication Date: 2023-08-15
- Inventor: Younghwan Son , Seogoo Kang , Jeehoon Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190093370 2019.07.31
- Main IPC: H10B43/27
- IPC: H10B43/27 ; G11C8/14 ; G11C7/18 ; H01L29/423 ; H01L29/792 ; H10B43/10 ; H01L21/28

Abstract:
A semiconductor device is disclosed. The semiconductor device includes a channel structure on a substrate and extending in a first direction perpendicular to a top surface of the substrate; a plurality of gate electrodes on the substrate and spaced apart from one another in the first direction on a sidewall of the channel structure; and a gate insulating layer between each of the plurality of gate electrodes and the channel structure, wherein the channel structure includes a body gate layer extending in the first direction; a charge storage structure surrounding a sidewall of the body gate layer; and a channel layer surrounding sidewall of the charge storage structure.
Public/Granted literature
- US20210036011A1 SEMICONDUCTOR DEVICES AND METHODS OF OPERATING THE SAME Public/Granted day:2021-02-04
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