A method for separating a first mechanical part from a second mechanical part is described, wherein the second mechanical part is bonded to the first mechanical part by an adhesive film along a connecting area, the first mechanical part having a first specific thermal conductivity and the second mechanical part having a second thermal conductivity that is higher than the first thermal conductivity. The method includes at least one cooling step during which the second mechanical part is cooled to a negative temperature and at least one stressing step during which the second mechanical part is subjected to mechanical stress in order to cause the adhesive film to break.