Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US16184961Application Date: 2018-11-08
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Publication No.: US11735260B2Publication Date: 2023-08-22
- Inventor: Yasuhiro Tomita
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: JP 18019747 2018.02.07
- Main IPC: G11C13/04
- IPC: G11C13/04 ; G11C13/00

Abstract:
A semiconductor memory device capable of satisfying multiple reliability conditions and multiple performance requirements is provided. A variable resistance memory of the disclosure makes it possible to write data in a memory array by changing a write condition according to the type of a write command from the outside. If the write command is an endurance-related command, an endurance algorithm is selected and data is written in an endurance storage area. If the write command is a retention-related command, a retention algorithm is selected and data is written in a retention storage area.
Public/Granted literature
- US20190244663A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2019-08-08
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