Invention Grant
- Patent Title: Microelectronic structures including bridges
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Application No.: US17740501Application Date: 2022-05-10
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Publication No.: US11735558B2Publication Date: 2023-08-22
- Inventor: Omkar G. Karhade , Nitin A. Deshpande , Mohit Bhatia , Anurag Tripathi , Takeshi Nakazawa , Steve Cho
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00
Abstract:
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Public/Granted literature
- US20220270998A1 MICROELECTRONIC STRUCTURES INCLUDING BRIDGES Public/Granted day:2022-08-25
Information query
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