- Patent Title: Splice device, and composite material automated lamination device
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Application No.: US17429468Application Date: 2020-01-09
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Publication No.: US11738961B2Publication Date: 2023-08-29
- Inventor: Akihito Suzuki , Kazuki Ishida , Kohei Muto , Tsuyoshi Okawara , Kenji Murakami , Makoto Inomoto
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka; Benjamin Hauptman; Kenneth Berner
- Priority: JP 19028188 2019.02.20
- International Application: PCT/JP2020/000445 2020.01.09
- International Announcement: WO2020/170639A 2020.08.27
- Date entered country: 2021-08-09
- Main IPC: B65H19/18
- IPC: B65H19/18 ; B29C70/38 ; B65H19/20

Abstract:
The present invention includes a first weight scale that senses first information necessary when acquiring the residual amount of a first composite material sheet wound on a first support rod; a second weight scale that senses second information necessary when acquiring the residual amount of a second composite material sheet wound on a second support rod; a first cutting part for cutting the first composite material sheet; a second cutting part for cutting the second composite material sheet; a pressure-bonding mechanism that pressure-bonds the first composite material sheet and the second composite material sheet; and a control device that controls the first cutting part, the second cutting part, and the pressure-bonding mechanism.
Public/Granted literature
- US20220106144A1 SPLICE DEVICE, AND COMPOSITE MATERIAL AUTOMATED LAMINATION DEVICE Public/Granted day:2022-04-07
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