Invention Grant
- Patent Title: Inner surface shape measurement device, and alignment method and magnification calibration method for inner surface shape measurement device
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Application No.: US17939080Application Date: 2022-09-07
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Publication No.: US11740072B2Publication Date: 2023-08-29
- Inventor: Hideki Morii , Katsufumi Moriyama
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 20046501 2020.03.17 JP 20046503 2020.03.17 JP 21003450 2021.01.13
- Main IPC: G01B11/12
- IPC: G01B11/12 ; G01B11/00 ; G01B21/04 ; G01B5/20

Abstract:
The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.
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