Invention Grant
- Patent Title: Inner surface shape measurement device, and alignment method for inner surface shape measurement device
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Application No.: US17939226Application Date: 2022-09-07
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Publication No.: US11740074B2Publication Date: 2023-08-29
- Inventor: Hideki Morii , Katsufumi Moriyama , Hiroaki Kimura
- Applicant: Tokyo Seimitsu Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee: TOKYO SEIMITSU CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 20046503 2020.03.17 JP 21003449 2021.01.13
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G01B11/00 ; G01B11/26

Abstract:
The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.
Public/Granted literature
- US20230028748A1 INNER SURFACE SHAPE MEASUREMENT DEVICE, AND ALIGNMENT METHOD FOR INNER SURFACE SHAPE MEASUREMENT DEVICE Public/Granted day:2023-01-26
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