Invention Grant
- Patent Title: Silicon photonics multi-channel parallel optical component and coupling method thereof
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Application No.: US17927755Application Date: 2021-06-17
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Publication No.: US11740417B2Publication Date: 2023-08-29
- Inventor: Baiquan Hu , Xuefeng Lin , Linke Li , Tianshu Wu , Xianwen Yang , Jian Zhang
- Applicant: LINKTEL TECHNOLOGIES CO., LTD.
- Applicant Address: CN Wuhan
- Assignee: LINKTEL TECHNOLOGIES CO., LTD.
- Current Assignee: LINKTEL TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Wuhan
- Agency: Bayramoglu Law Offices LLC
- Priority: CN 2110412405.6 2021.04.16
- International Application: PCT/CN2021/100470 2021.06.17
- International Announcement: WO2022/217736A 2022.10.20
- Date entered country: 2022-11-25
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.
Public/Granted literature
- US20230194808A1 SILICON PHOTONICS MULTI-CHANNEL PARALLEL OPTICAL COMPONENT AND COUPLING METHOD THEREOF Public/Granted day:2023-06-22
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