发明授权
- 专利标题: Optical subassembly
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申请号: US17038076申请日: 2020-09-30
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公开(公告)号: US11740419B2公开(公告)日: 2023-08-29
- 发明人: Daisuke Noguchi , Hiroshi Yamamoto
- 申请人: CIG Photonics Japan Limited
- 申请人地址: JP Kanagawa
- 专利权人: CIG PHOTONICS JAPAN LIMITED
- 当前专利权人: CIG PHOTONICS JAPAN LIMITED
- 当前专利权人地址: JP Sagamihara
- 代理机构: MATTINGLY & MALUR, PC
- 优先权: JP 19199887 2019.11.01 JP 20127761 2020.07.28
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/18 ; G02B6/42 ; H01S5/024 ; H04Q11/00 ; H01S5/02212 ; H01S5/02345
摘要:
Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.
公开/授权文献
- US20210132305A1 OPTICAL SUBASSEMBLY 公开/授权日:2021-05-06
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