公开(公告)号：US11641092B2

公开(公告)日：2023-05-02

申请号：US17173337

申请日：2021-02-11

申请人： TERADIODE, INC.

发明人： Won Tae Lee ,  Michael Deutsch ,  Zhongyong Liu

IPC分类号： G02B5/18 ,  G02B7/18 ,  G02B27/44 ,  H01S5/0237 ,  H01S5/024 ,  H01S5/40 ,  H01S5/14 ,  H01S5/0236 ,  H01S5/02345

摘要： In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.

公开(公告)号：US11611193B2

公开(公告)日：2023-03-21

申请号：US16666714

申请日：2019-10-29

申请人： Excelitas Canada, Inc.

发明人： Gabriel Charlebois ,  JinHan Ju ,  Lawrence Godfrey

IPC分类号： H01S5/042 ,  H05K1/18 ,  H05K3/30 ,  H01L23/48 ,  H01L23/495 ,  H03K17/687 ,  H05K1/11 ,  H05K1/16 ,  H05K7/20 ,  H01S5/0231 ,  H01S5/02234 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/40

摘要： A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

公开(公告)号：US11605936B2

公开(公告)日：2023-03-14

申请号：US16953297

申请日：2020-11-19

申请人： FUJIFILM Business Innovation Corp.

发明人： Daisuke Iguchi

IPC分类号： H01S5/00 ,  H01S5/42 ,  H01S5/183 ,  H01S5/042 ,  H01S5/02345 ,  H01S5/024 ,  H01S5/30

摘要： A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

公开(公告)号：US11575244B2

公开(公告)日：2023-02-07

申请号：US16958091

申请日：2018-12-27

申请人： ROHM CO., LTD.

发明人： Hiroyuki Tajiri

IPC分类号： H01S5/02345 ,  H01S5/026 ,  H01S5/02 ,  H01S5/022

摘要： A semiconductor laser device includes a semiconductor laser element, a base material supporting the semiconductor laser element, and a wiring portion formed on the base material and constituting a conduction path to the semiconductor laser element. The base material includes a mounting face oriented to one side in a thickness direction of the base material and having the semiconductor laser element mounted thereon, while also including an emission part located on one side with respect to the semiconductor laser element in a first direction perpendicular to the thickness direction. Light from the semiconductor laser element is emitted through the emission part to the outside.

公开(公告)号：US11573374B2

公开(公告)日：2023-02-07

申请号：US16835003

申请日：2020-03-30

申请人： KYOCERA SLD Laser, Inc.

发明人： Eric Goutain ,  James W. Raring ,  Paul Rudy ,  Hua Huang

IPC分类号： H01S5/00 ,  G02B6/27 ,  F21K9/64 ,  H01S5/024 ,  H01S5/22 ,  H01S5/343 ,  H01S5/40 ,  B82Y20/00 ,  G02B6/42 ,  F21K9/60 ,  F21V9/32 ,  F21V9/30 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0235 ,  H01S5/02251 ,  H01S5/02255 ,  H01S5/02326 ,  F21V29/71 ,  F21V29/83 ,  F21V23/06 ,  F21V8/00 ,  H01S5/02224 ,  H01S5/323 ,  F21K9/62 ,  G02B6/26 ,  F21Y115/30 ,  F21Y115/10 ,  F21Y101/00 ,  H01S5/028 ,  H01S5/02208 ,  H01S5/042 ,  H01S5/02345

摘要： A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

公开(公告)号：US11550099B2

公开(公告)日：2023-01-10

申请号：US16575938

申请日：2019-09-19

申请人： The Research Foundation for The State University of New York

发明人： William Charles ,  Douglas Coolbaugh ,  Douglas La Tulipe ,  Gerald L. Leake, Jr.

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/43 ,  H01S5/026 ,  G02B6/13 ,  H01L31/101 ,  H01S5/02345 ,  H01S5/02

摘要： There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.

公开(公告)号：US11539191B2

公开(公告)日：2022-12-27

申请号：US16712940

申请日：2019-12-12

申请人： FUJIFILM Business Innovation Corp.

发明人： Kenichi Ono ,  Takeshi Minamiru ,  Satoshi Inada ,  Takafumi Higuchi ,  Tsutomu Otsuka

IPC分类号： H01S5/042 ,  H01S5/42 ,  G06F21/32 ,  G02B5/02 ,  H01S5/02325 ,  H01S5/183 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/22 ,  H01S5/343

摘要： A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that is provided on plural wires connected to the light source and holds the light diffusing member.

公开(公告)号：US20220329040A1

公开(公告)日：2022-10-13

申请号：US17620729

申请日：2020-06-30

申请人： LANDA LABS (2012) LTD.

发明人： Ronny COSTI ,  Gilad REUT GELBART

IPC分类号： H01S5/02315 ,  H01S5/02345 ,  H01S5/0237 ,  H01S5/024 ,  H01S5/02 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

摘要： A method is disclosed for mounting and cooling a circuit component having aplurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive and electrically insulating material with a circuit board arranged between the circuit component and the substrate. The circuit board, which has a flexible base and carries conductive traces that terminate in contact pads, is secured to the rigid substrate with at least some of the contact pads on the circuit board disposed on the side of the circuit board facing the rigid substrate, at least some of the latter contact pads being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the flexible base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate. The side of the contact pads exposed by the holes is plated to form conductive vias that fill the holes and that are soldered to the contacts of the circuit component.

公开(公告)号：US20220329038A1

公开(公告)日：2022-10-13

申请号：US17849852

申请日：2022-06-27

申请人： NICHIA CORPORATION

发明人： Takuya HASHIMOTO

IPC分类号： H01S5/02216 ,  H01S5/02345 ,  H01L33/48 ,  H01L33/62

摘要： A light emission device includes: a base part; a semiconductor laser device disposed on the base part; a frame body fixed to the base part and provided around the semiconductor laser device; a lid bonded to an upper surface of the frame body; and a first electrical conduction member bonded to an outer surface of the base part or an outer surface of the frame body, the first electrical conduction member having a first conductive region and a second conductive region that are electrically connected to the semiconductor laser device. In a top plan view, the first electrical conduction member includes a first portion overlapping the frame body and a second portion not overlapping the frame body, the first conductive region being contained in the first portion, and the second conductive region being contained in the second portion.

公开(公告)号：US20220302674A1

公开(公告)日：2022-09-22

申请号：US17638093

申请日：2020-08-12

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Kiyohisa SAKAI ,  Hirohisa YASUKAWA

IPC分类号： H01S5/02345 ,  H01S5/026 ,  H01S5/02

摘要： An object of the present technique is to easily downsize a semiconductor laser driving apparatus incorporating a laser driver. A semiconductor laser driving apparatus includes a substrate, a laser driver, a semiconductor laser, side walls, and a test pad. The substrate incorporates the laser driver. The semiconductor laser is mounted on one surface of the substrate of the semiconductor laser driving apparatus. Connection wiring electrically connects the laser driver and the semiconductor laser to each other with a wiring inductance of 0.5 nanohenries or less. The outer walls surround a predetermined mounting region that is included in the one surface of the substrate and where the semiconductor laser is mounted. The test pad is provided in a region that is included in the one surface of the substrate but does not correspond to the mounting region.