- 专利标题： Electrostatic puck assembly with metal bonded backing plate
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申请号： US17143064申请日： 2021-01-06
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公开(公告)号： US11742225B2公开(公告)日： 2023-08-29
- 发明人: Vijay D. Parkhe
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Lowenstein Sandler LLP
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01J37/32 ; H01L21/683 ; H01L21/687
摘要：
An electrostatic puck assembly includes an upper puck plate, a lower puck plate and a backing plate. The upper puck plate comprises AlN or Al2O3 and has a first coefficient of thermal expansion. The lower puck plate comprises a material having a second coefficient of thermal expansion that approximately matches the first coefficient of thermal expansion and is bonded to the upper puck plate by a first metal bond. The backing plate comprises AlN or Al2O3 and is bonded to the lower puck plate by a second metal bond.
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