Invention Grant
- Patent Title: Electronic package and manufacturing method thereof
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Application No.: US17134925Application Date: 2020-12-28
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Publication No.: US11742296B2Publication Date: 2023-08-29
- Inventor: Wei-Jhen Chen , Chih-Hsun Hsu , Yuan-Hung Hsu , Chih-Nan Lin , Chang-Fu Lin , Don-Son Jiang , Chih-Ming Huang , Yi-Hsin Chen
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW 9139525 2020.11.12
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/00 ; H01L25/065 ; H01L25/00
Abstract:
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Public/Granted literature
- US20220148975A1 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-05-12
Information query
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