Abstract:
A substrate structure and a method for fabricating the same are provided. A barrier layer is formed on an entire top surface of a wiring layer of a substrate body to isolate the wiring layer from moisture and prevent the wiring layer from being oxidized. Therefore, the wiring layer is securely bonded to an insulation layer, thereby preventing the delamination or peeling problem from occurring.
Abstract:
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Abstract:
A conductive bump structure is formed on a substrate having a plurality of bonding pads and a first insulating layer thereon. The first insulating layer has a plurality of openings formed therein for exposing the bonding pads and a conductive post is formed on the bonding pads exposed through the openings. Therein, a gap is formed between the conductive post and the wall of the opening such that no contact occurs between the conductive post and the first insulating layer, thereby preventing delamination of the conductive bump structure caused by stresses concentrating on an interface of different materials as in the prior art.
Abstract:
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Abstract:
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.
Abstract:
A fabrication method of a semiconductor structure includes providing a chip having at least an electrode pad, forming a titanium layer on the electrode pad, forming a dielectric layer on the chip and a portion of the titanium layer, forming a copper layer on the dielectric layer and the titanium layer, forming a conductive pillar on the copper layer corresponding in position to the titanium layer, and removing a portion of the copper layer that is not covered by the conductive pillar. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability.