Invention Grant
- Patent Title: Method of manufacturing electronic device
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Application No.: US17482438Application Date: 2021-09-23
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Publication No.: US11742319B2Publication Date: 2023-08-29
- Inventor: Yi-An Chen , Wan-Ling Huang , Tsau-Hua Hsieh
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Priority: CN 2011008889.X 2020.09.23 CN 2111108666.5 2021.09.22
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L33/50 ; H01L33/56
Abstract:
A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.
Public/Granted literature
- US20220093558A1 METHOD OF MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2022-03-24
Information query
IPC分类:
