- 专利标题: Semiconductor device and method for forming the same
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申请号: US17183564申请日: 2021-02-24
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公开(公告)号: US11742348B2公开(公告)日: 2023-08-29
- 发明人: Li-Feng Teng , Wei-Cheng Wu , Harry-Hak-Lay Chuang , Li-Jung Liu
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/8234 ; H01L29/66
摘要:
A semiconductor device includes a substrate, a first gate structure and a second gate structure, a first gate spacer and a second gate spacer. The first gate spacer includes a first layer, a second layer over the first layer, a third layer over the second layer, a fourth layer over the third layer, and a fifth layer of the fourth layer, in which the first layer, the third layer, and the fifth layer of the first gate spacer are made of a same material. The second gate spacer includes a first layer, a second layer over the first layer, and a third layer over the second layer, in which the first layer and the third layer of the second gate spacer are made of a same material, and in which a lateral width of the first gate spacer is greater than a lateral width of the second gate spacer.
公开/授权文献
- US20220271031A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME 公开/授权日:2022-08-25
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