Techniques for using a pin array to support a 3D printed object during sintering are disclosed. An example method includes adjusting pins of a pin array to provide support for a bottom surface of the 3D printed object, and placing the 3D printed object on the pin array. The method also includes placing the 3D printed object and pin array in a sintering oven, and heating the 3D printed object in the sintering oven to sinter the 3D printed object while being supported by the pin array.