Invention Grant
- Patent Title: See-through metrology systems, apparatus, and methods for optical devices
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Application No.: US17492826Application Date: 2021-10-04
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Publication No.: US11748875B2Publication Date: 2023-09-05
- Inventor: Yangyang Sun , Jinxin Fu , Kazuya Daito , Ludovic Godet
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/90 ; G06T7/80 ; G01J1/42 ; G02B27/01 ; G01J1/44 ; G01N21/958 ; H04N23/56 ; H04N23/74 ; H04N23/90
Abstract:
Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of see-through metrics for optical devices.
Public/Granted literature
- US20220121030A1 SEE-THROUGH METROLOGY SYSTEMS, APPARATUS, AND METHODS FOR OPTICAL DEVICES Public/Granted day:2022-04-21
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