Invention Grant
- Patent Title: Semiconductor memory device capable of performing soft-post-package-repair operation
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Application No.: US17578305Application Date: 2022-01-18
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Publication No.: US11749366B2Publication Date: 2023-09-05
- Inventor: Yasushi Matsubara , Alan Wilson , Minoru Someya
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G11C29/02
- IPC: G11C29/02 ; G11C29/44 ; G11C29/12 ; G11C7/10 ; G11C29/18 ; G11C8/18

Abstract:
Disclosed herein is an apparatus that includes a fuse array circuit including a plurality of fuse sets each assigned to a corresponding one of a plurality of fuse addresses and configured to operatively store a fuse data, and a first circuit configured to generate and sequentially update a fuse address to sequentially read the fuse data from the plurality of fuse sets. The first circuit is configured to change a frequency of updating the fuse address based on a first signal.
Public/Granted literature
- US20230230648A1 SEMICONDUCTOR MEMORY DEVICE CAPABLE OF PERFORMING SOFT-POST-PACKAGE-REPAIR OPERATION Public/Granted day:2023-07-20
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