- Patent Title: Heat-emitting transparent plate, method of manufacturing the heat-emitting transparent plate, heat-emitting device including the heat-emitting transparent plate and objects including the heat-emitting device
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Application No.: US16713254Application Date: 2019-12-13
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Publication No.: US11751288B2Publication Date: 2023-09-05
- Inventor: Junghyun Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20180162154 2018.12.14
- Main IPC: H05B1/02
- IPC: H05B1/02 ; F21V7/00 ; F21V5/00 ; H05B6/46 ; F21W107/10

Abstract:
A heat-emitting transparent plate includes a heat-emitting region that is transparent to visible light and is a region that emits heat by absorbing infrared rays. The heat-emitting region includes a meta-surface, and the meta-surface includes a plurality of meta-patterns to absorb infrared rays. A method of manufacturing a heat-emitting transparent plate includes forming a material layer on a transparent substrate and forming a plurality of patterns on the transparent substrate by patterning the material layer. The plurality of patterns include a material that is transparent to visible light and that emits heat by absorbing infrared rays, and a pitch of the plurality of patterns is less than a wavelength of the infrared rays. A heat-emitting device includes the heat-emitting transparent plate and a light source.
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