Invention Grant
- Patent Title: Controlled deposition of materials using a differential pressure regime
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Application No.: US17380169Application Date: 2021-07-20
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Publication No.: US11751468B2Publication Date: 2023-09-05
- Inventor: William E. Quinn , Siddharth Harikrishna Mohan , Gregory McGraw , Xin Xu
- Applicant: Universal Display Corporation
- Applicant Address: US NJ Ewing
- Assignee: Universal Display Corporation
- Current Assignee: Universal Display Corporation
- Current Assignee Address: US NJ Ewing
- Agency: BUTZEL LONG
- The original application number of the division: US15449946 2017.03.04
- Main IPC: H10K71/12
- IPC: H10K71/12 ; C23C14/24 ; C23C14/12 ; C23C14/04 ; C23C14/54 ; H10K71/00 ; H10K71/18 ; B41J2/14 ; B41M3/00 ; H10K50/11 ; H10K101/30 ; H10K101/40
Abstract:
Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.
Public/Granted literature
- US20210351350A1 CONTROLLED DEPOSITION OF MATERIALS USING A DIFFERENTIAL PRESSURE REGIME Public/Granted day:2021-11-11
Information query
