Invention Grant
- Patent Title: Heavy-hex connection topology to rectilinear physical layout
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Application No.: US16935698Application Date: 2020-07-22
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Publication No.: US11751491B2Publication Date: 2023-09-05
- Inventor: Isaac Lauer , Neereja Sundaresan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: G06N10/00
- IPC: G06N10/00 ; H10N69/00 ; H10N60/12 ; H10N60/01

Abstract:
Systems and techniques that facilitate mapping a heavy-hex qubit connection topology to a rectilinear physical qubit layout are provided. In various embodiments, a device can comprise a qubit lattice on a substrate. In various aspects, the qubit lattice can comprise one or more first qubit tiles. In various cases, the one or more first qubit tiles can have a first shape. In various instances, the qubit lattice can further comprise one or more second qubit tiles. In various cases, the one or more second qubit tiles can have a second shape. In various aspects, the one or more first qubit tiles can be tessellated with the one or more second qubit tiles.
Public/Granted literature
- US20220028927A1 HEAVY-HEX CONNECTION TOPOLOGY TO RECTILINEAR PHYSICAL LAYOUT Public/Granted day:2022-01-27
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