Invention Grant
- Patent Title: Apparatus for processing substrate
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Application No.: US17453506Application Date: 2021-11-04
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Publication No.: US11752516B2Publication Date: 2023-09-12
- Inventor: Dongkeun Lee , Jongho Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20210011699 2021.01.27
- Main IPC: B05C5/02
- IPC: B05C5/02 ; G03F7/16

Abstract:
The inventive concept provides an apparatus for processing a substrate. The apparatus includes a mount; a processing liquid supply nozzle configured to provide a processing liquid to the substrate and a discharge container including: a base plate including a liquid outlet and an exhaust port; an inner wall standing on an inner circumference of the base plate; an outer wall standing on an outer circumference of the base plate; and a barrier standing on the base plate to separate a first space connected to the liquid outlet from a second space connected to the exhaust port. The apparatus further includes an inner cover configured to guide the flow of a processing liquid from the substrate supported by the mount to the first space of the discharge container; and a flow guide mounted in the first space of the discharge container.
Public/Granted literature
- US20220234069A1 APPARATUS FOR PROCESSING SUBSTRATE Public/Granted day:2022-07-28
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