Invention Grant
- Patent Title: Multilayer polyimide film and method for manufacturing same
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Application No.: US17641879Application Date: 2019-10-23
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Publication No.: US11752744B2Publication Date: 2023-09-12
- Inventor: Ki-Hoon Kim , Kil-Nam Lee
- Applicant: PI Advanced Materials Co., Ltd.
- Applicant Address: KR Chungcheongbuk
- Assignee: PI Advanced Materials Co., Ltd.
- Current Assignee: PI Advanced Materials Co., Ltd.
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Brooks, Cameron & Huebsch, PLLC
- Priority: KR 20190112533 2019.09.11
- International Application: PCT/KR2019/013956 2019.10.23
- International Announcement: WO2021/049707A 2021.03.18
- Date entered country: 2022-03-10
- Main IPC: B32B27/28
- IPC: B32B27/28 ; C08G73/10 ; B32B15/08 ; B32B15/20 ; B32B27/08 ; B32B27/26

Abstract:
The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.
Public/Granted literature
- US20220324213A1 MULTILAYER POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME Public/Granted day:2022-10-13
Information query