Invention Grant
- Patent Title: Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent
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Application No.: US16492378Application Date: 2018-01-26
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Publication No.: US11753499B2Publication Date: 2023-09-12
- Inventor: Kohei Takeda , Sayaka Wakioka , Yuta Oatari , Takashi Shinjo , Masami Shindo
- Applicant: SEKISUI CHEMICAL CO., LTD.
- Applicant Address: JP Osaka
- Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee: SEKISUI CHEMICAL CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 17013558 2017.01.27
- International Application: PCT/JP2018/002367 2018.01.26
- International Announcement: WO2018/139558A 2018.08.02
- Date entered country: 2019-09-09
- Main IPC: C08G59/40
- IPC: C08G59/40 ; C08G73/10 ; C08L63/00 ; C08L79/08 ; C09J163/00 ; C09J179/08
Abstract:
An imide oligomer is provided for use in a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. Also provided are a curable resin composition and an imide oligomer composition each containing the imide oligomer, an adhesive containing the curable resin composition, and a curing agent containing the imide oligomer composition.
Public/Granted literature
- US11802177B2 Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent Public/Granted day:2023-10-31
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