Invention Grant
- Patent Title: Inspection system of semiconductor wafer and method of driving the same
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Application No.: US17501318Application Date: 2021-10-14
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Publication No.: US11754510B2Publication Date: 2023-09-12
- Inventor: Doyoung Yoon , Jeongho Ahn , Dongryul Lee , Dongchul Ihm , Chungsam Jun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Main IPC: G01N21/95
- IPC: G01N21/95 ; H01L21/66 ; G01N21/88 ; G01N21/956

Abstract:
A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.
Public/Granted literature
- US20230123710A1 INSPECTION SYSTEM OF SEMICONDUCTOR WAFER AND METHOD OF DRIVING THE SAME Public/Granted day:2023-04-20
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