Invention Grant
- Patent Title: Semiconductor device with a protection mechanism and associated systems, devices, and methods
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Application No.: US17170120Application Date: 2021-02-08
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Publication No.: US11756844B2Publication Date: 2023-09-12
- Inventor: Wei Zhou , Bret K. Street , Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- The original application number of the division: US15693230 2017.08.31
- Main IPC: H01L23/532
- IPC: H01L23/532 ; H01L23/10 ; H01L25/065 ; H01L23/00 ; H01L23/04 ; H01L25/00
Abstract:
A semiconductor device includes a substrate; a die attached over the substrate; and a metal enclosure continuously encircling a space and extending vertically between the substrate and the die.
Public/Granted literature
- US20210183716A1 SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS Public/Granted day:2021-06-17
Information query
IPC分类:
