Invention Grant
- Patent Title: Micromechanical arm array in micro-electromechanical system (MEMS) actuators
-
Application No.: US17833827Application Date: 2022-06-06
-
Publication No.: US11757378B1Publication Date: 2023-09-12
- Inventor: Shih-Yu Liao , Tsai-Hao Hung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H02N1/00
- IPC: H02N1/00 ; B81B7/00 ; B81B5/00 ; H04N23/68

Abstract:
A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.
Public/Granted literature
- US1732804A Rail-handling tool Public/Granted day:1929-10-22
Information query