- 专利标题: Micromechanical arm array in micro-electromechanical system (MEMS) actuators
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申请号: US17833827申请日: 2022-06-06
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公开(公告)号: US11757378B1公开(公告)日: 2023-09-12
- 发明人: Shih-Yu Liao , Tsai-Hao Hung
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: H02N1/00
- IPC分类号: H02N1/00 ; B81B7/00 ; B81B5/00 ; H04N23/68
摘要:
A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.
公开/授权文献
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