Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17955570Application Date: 2022-09-29
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Publication No.: US11757478B2Publication Date: 2023-09-12
- Inventor: Shigeru Tsuchida , Daerok Oh , Takahiro Katamata , Satoshi Goto , Mitsunori Samata , Yoshiki Yasutomo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: XSENSUS LLP
- Priority: JP 19186318 2019.10.09 JP 20057833 2020.03.27
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F1/56 ; H03F3/24

Abstract:
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.
Public/Granted literature
- US20230020088A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2023-01-19
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