- 专利标题: Slotted vias for circuit boards
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申请号: US17319577申请日: 2021-05-13
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公开(公告)号: US11758644B2公开(公告)日: 2023-09-12
- 发明人: Jason Pritchard , Charles W. Ziegler, IV , Qianwen Wang , Lingyu Kong
- 申请人: Dell Products L.P.
- 申请人地址: US TX Round Rock
- 专利权人: Dell Products L.P.
- 当前专利权人: Dell Products L.P.
- 当前专利权人地址: US TX Round Rock
- 代理机构: Jackson Walker L.L.P
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11
摘要:
A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.
公开/授权文献
- US20220369452A1 SLOTTED VIAS FOR CIRCUIT BOARDS 公开/授权日:2022-11-17
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