Invention Grant
- Patent Title: Flexible printed circuit board and electronic device including the same
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Application No.: US17246271Application Date: 2021-04-30
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Publication No.: US11758650B2Publication Date: 2023-09-12
- Inventor: Dae Jung Byun , Jung Soo Kim , Sang Hyun Sim , Chang Min Ha , Jin Won Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200160268 2020.11.25
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; G06F1/16
Abstract:
A flexible printed circuit board includes a base film; a circuit pattern disposed on one surface of the base film; and a coverlay film covering the circuit pattern. The base film is divided into a flexible area and a rigid area, and the circuit pattern of the flexible area comprises a portion thinner than a portion of the circuit pattern of the rigid area.
Public/Granted literature
- US20220167496A1 FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2022-05-26
Information query
